Tag «Indium Corporation»

Indium Corporation Announces Void-Reducing Water-Soluble Solder Paste

Indium6.4 Water-Soluble Solder Paste’s flux chemistry minimizes voiding under QFN and BGA assemblies. A typical water-soluble solder paste has approximately 15-30 percent voiding; however, Indium6.4 consistently yields less than five percent. Indium6.4 provides: Fewer voids Smaller voids Good cleanability and reflow properties Exceptional response-to-pause printing Extended stencil life Exceptional slump resistance Indium6.4 is manufactured with …

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Indium Corporation Announces New PoP Solder Paste

Indium9.91 is a no-clean solder paste designed for use inpackage-on-package (PoP) applications 0.3mm and larger. Its rheology optimizes both dipping and packageretention. Indium9.91: Eliminates defects due to packagewarping Provides excellent solderability Has a long pot life Provides consistent solder paste volumes Indium9.91 can be used with SAC305 and Sn63/Pb37 alloys. Indium Corporationis a premier materials …

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Indium Corporation Product Specialist to Present at IMAPS Conference

Indium Corporation’s Maria Durham, Product Specialist – Semiconductor and Advanced Assembly Materials, will present at the International Microelectronics and Packaging Society (IMAPS) International Conference and Exhibition on Device Packaging in Scottsdale, Arizona on Tuesday, March 12. Durham’s presentation, Semiconductor Fluxes for Wafer Bumping in 3D Assembly, examines, both experimentally and with theoretical analysis, the spin-coating …

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